The HybridPACK Drive G2 Fusion is the first plug'n'play power module that implements a combination of Infineon’s silicon and ...

Infineon Technologies is intensifying its collaboration with suppliers to further reduce CO 2 emissions along the whole ...

SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced the ...

Heidelberg Instruments has launched its new NanoFrazor nanolithography system, advancing decades of expertise in micro- and ...

Nova says that one of the world's leading logic manufacturers recently qualified Nova Prism 2 to address backside power ...

UC Santa Barbara researchers have achieved the first-ever “movie” of electric charges traveling across the interface of two ...

Mitsubishi Electric's Power Device Works' Fukuyama Factory has begun large-scale supply of power semiconductor chips made ...

The partnership with IPro Silicon IP Ltd. will allow Baya Systems to scale its groundbreaking technology across new global markets. IPro, a leading supplier of custom processors, security solutions, ...

The electronic design automation (EDA) industry reported substantial revenue growth in Q2 2024,” said Walden C. Rhines, ...

Expanded network-on-chip tiling supported by mesh topology capabilities in FlexNoC and Ncore interconnect IP products allow systems-on-chip with AI to easily scale by more than 10 times without ...

With a shared vision for transparency and open-source innovation, SensiML and Efabless are addressing two of the most complex challenges in IoT development: Sourcing silicon optimized to suit the ...

Hosted by SEMI Southeast Asia and the Asia Clean Energy Coalition (ACEC), the roundtable, titled ‘Accelerating Clean Energy ...